Unique and advanced 3D/2.5D IC process and MEMS process
T-Micro is the unique and advanced 3D / 2.5D IC process and MEMS process-specialized foundry, originated in Tohoku University.
We provide worldwide customers with 3D / 2.5D / MEMS full foundry service as well as partial process service and small volume production by use of a complete line of state-of-the-art 200 and 300mm equipment.
We can provide the following services
(1) 3D stacking LSIs prototype manufacturing service
(2) Support your small-volume, special customized 3D productions
(3) 2.5D interposer R&D foundry and pilot production service
(4) Development innovative 3D stacking technologies for creative 3D products and applications.
Makoto Motoyoshi, Ph. D., is President of Tohoku-MicroTec Co., Ltd. In 1982, he joined Hitachi, Ltd., Tokyo, where he had been involved in the research and development of SRAM device, especially high speed SRAM for super computer. In September 1992, He joined Sony Corporation, where he had responsibility for HR SRAM, BiCMOS SRAM and Cache SRAM device development. From 2001 to 2005 he was responsible for development of emerging memory device include MRAM (magnetic RAM) and STT-RAM (Spin Transfer Torque RAM), FeRAM and RRAM. In 2005 He joined ZyCube where he had responsible to develop 3D IC technology and MEMS device technologies. April 2010, he established Tohoku-MicroTec specializing in advanced 3D IC technology and Bioelectronics device. From 1997 to 1998, he was the subcommittee member on Device Interconnect technology of IEDM. He received his Ph. D. in bioengineering and robotics from Tohoku University.
PhD (Tohoku University)